MIC5376 datasheet(5/24 Pages) MICROCHIP

tên linh kiện	MIC5376

Giải thích chi tiết về linh kiện	High Performance Low Dropout 150 mA LDO

PDF	24 Pages

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nhà sản xuất	MICROCHIP [Microchip Technology]

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2018 - 2022 Microchip Technology Inc. and its subsidiaries

DS20006080B-page 5

MIC5376/7/8

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Lead Temperature

—

+260

°C

Soldering, 5 sec.

Storage Temperature

–65

—

+150

°C

—

Package Thermal Resistances

Thermal Resistance, 1x1 UDFN 4-Ld

JA

—

250

—

°C/W —

Thermal Resistance, 1.2x1.2 TQFN

8-Ld

JA

—

250

—

°C/W —

Thermal Resistance, SC-70-5

JA

—

256.5

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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