RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

Y2

X2

4.50

4.50

MILLIMETERS

0.50 BSC

MIN

E

MAX

5.90

Contact Pad Length (Xnn)

Contact Pad Width (Xnn)

Y1

X1

0.85

0.30

NOM

1

2

36

C1

Contact Pad Spacing

5.90

Contact Pad to Contact Pad (Xnn)

G2

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2019 Microchip Technology Inc.

Contact Pad to Center Pad (Xnn)

G1

0.20

C1

EV

EV

X2

Y2

C2

E

X1

Y1

G1

G2

ØV

SILK SCREEN

Microchip Technology Drawing C04-2501 Rev B

36-Lead Very Thin Plastic Quad Flat, No Lead Package (LNX) - 6x6x1.0 mm Body [VQFN]

With 4.4 mm Exposed Pad and Stepped Wettable Flanks

LAN8670/1/2

Packaging Information

and its subsidiaries

Product Brief

DS60001536E-page 24