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STM32H750VB bảng dữ liệu(PDF) 98 Page - STMicroelectronics

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STM32H750VB bảng dữ liệu(HTML) 98 Page - STMicroelectronics

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Electrical characteristics (rev Y)
STM32H750VB STM32H750ZB STM32H750IB STM32H750XB
98/334
DS12556 Rev 5
6.3
Operating conditions
6.3.1
General operating conditions
Table 22. General operating conditions
Symbol
Parameter
Operating conditions
Min
Max
Unit
VDD
Standard operating voltage
-
1.62(1)
3.6
V
VDDLDO
Supply voltage for the internal regulator
VDDLDO ≤ VDD
1.62(1)
3.6
VDD33USB Standard operating voltage, USB domain
USB used
3.0
3.6
USB not used
0
3.6
VDDA
Analog operating voltage
ADC or COMP used
1.62
3.6
DAC used
1.8
OPAMP used
2.0
VREFBUF used
1.8
ADC, DAC, OPAMP,
COMP, VREFBUF not
used
0
VIN
I/O Input voltage
TT_xx I/O
−0.3
VDD+0.3
BOOT0
0
9
All I/O except BOOT0
and TT_xx
−0.3
Min(VDD, VDDA,
VDD33USB)+3.6V
< 5.5V(2)(3)
TA
Ambient temperature for
the suffix 6 version
Maximum power dissipation
–40
85
°C
Low-power dissipation(4)
–40
105
TJ
Junction temperature
range
Suffix 6 version
–40
125
°C
1. When RESET is released functionality is guaranteed down to VBOR0 min
2. This formula has to be applied on power supplies related to the IO structure described by the pin definition table.
3. For operation with voltage higher than Min (VDD, VDDA, VDD33USB) +0.3V, the internal Pull-up and Pull-Down resistors must
be disabled.
4. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 8.6:
Thermal characteristics).



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