MPC7445 datasheet(9/56 Pages) NXP

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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

General Parameters

The following list is a summary of the general parameters of the MPC7447A:

Technology

0.13-

μm CMOS, nine-layer metal

Die size

8.51 mm

× 9.86 mm

Transistor count

48.6 million

Logic design

Fully-static

Packages

Surface mount 360 ceramic ball grid array (HCTE)

Surface mount RoHS-compliant 360 ceramic ball grid array (HCTE)

Surface mount 360 ceramic land grid array (HCTE)

Core power supply

1.3 V ± 50 mV DC (nominal), or

1.2 V ± 50 mV DC (derated)

I/O power supply

1.8 V ± 5% DC, or

2.5 V ± 5% DC

Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the

MPC7447A.

5.1

DC Electrical Characteristics

The tables in this section describe the MPC7447A DC electrical characteristics. Table 2 provides the

absolute maximum ratings.

Number of 32-byte sectors/line

Parity

Byte

Thermal Control

Dynamic frequency switching (DFS)

Yes

Thermal diode

Yes

Table 2. Absolute Maximum Ratings1

Characteristic

Symbol

Maximum Value

Unit Notes

Core supply voltage

VDD

–0.3 to 1.60

PLL supply voltage

AVDD

–0.3 to 1.60

Processor bus supply voltage

BVSEL = 0

OVDD

–0.3 to 1.95

3, 4

BVSEL = HRESET or OVDD

OVDD

–0.3 to 2.7

3, 5

Input voltage

Processor bus

Vin

–0.3 to OVDD + 0.3

6, 7

JTAG signals

Vin

–0.3 to OVDD + 0.3

—

Table 1. Microarchitecture Comparison (continued)

Microarchitectural Specs

MPC7447A

MPC7447

MPC7445

MPC7441

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