Figure 4-3. Top-Layer Copper PCB Layout

0.30

5.80

0.90

3.50

3.80

0.50

Figure 4-4. Paste Mask

0.23

5.38

0.66

14.53

33.00

All dimensions in mm

Note: The contract manufacturer has latitude to modify the solder paste stencil for manufacturability reasons. The

solder paste stencil covers 65% to 80% of the thermal pad and must not allow solder to be applied to the thermal vias

PD39210

Package Information

Datasheet

DS00003554C-page 14