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HMC8108LC5TR-R5 bảng dữ liệu(PDF) 5 Page - Analog Devices |
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HMC8108LC5TR-R5 bảng dữ liệu(HTML) 5 Page - Analog Devices |
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5 / 18 page ![]() Data Sheet HMC8108 Rev. 0 | Page 5 of 18 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 17 1 3 4 2 NIC NIC LNA_VG1 NIC 5 6 RFIN NIC 7 VCTRL 8 NIC NIC 18 NIC 19 NIC 20 LOIN 21 NIC 22 NIC 23 BUFF_VD 24 NIC HMC8108 TOP VIEW (Not to Scale) EPAD NOTES 1. NIC = NOT INTERNALLY CONNECTED. 2. EXPOSED PAD. EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 4, 6, 8, 9, 11, 12, 14, 17 to 19, 21, 22, 24, 25, 27, 29, 31 NIC No Internal Connection. These pins are not connected internally. 3 LNA_VG1 Gate Bias Voltage for the First Low Noise Amplifier. See Figure 3 for the interface schematic. 5 RFIN Radio Frequency Input. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the interface schematic. 7 VCTRL Voltage Control. Gate bias attenuation control for the low noise amplifier. See Figure 5 for the interface schematic. 10 LNA_VG2 Gate Bias Voltage for the Second Low Noise Amplifier. See Figure 6 for the interface schematic. 13, 28 IF_I, IF_Q In-Phase and Quadrature Intermediate Frequency Output Pins. See Figure 7 for the interface schematic. 15 MIX_VG Gate Bias Voltage for FET Mixer. See Figure 8 for the interface schematic. 16 BUFF_VG Gate Bias Voltage for the Local Oscillator Buffer. See Figure 9 for the interface schematic. 20 LOIN Local Oscillator Input. This pin is ac-coupled and matched to 50 Ω. See Figure 10 for the interface schematic. 23 BUFF_VD Drain Bias Voltage for the Local Oscillator Buffer. See Figure 11 for the interface schematic. 26 GND Ground Connect. This pin must be connected to RF/dc ground. See Figure 12 for the interface schematic. 30 LNA_VD2 Drain Bias Voltage for the Second Low Noise Amplifier. See Figure 13 for the interface schematic. 32 LNA_VD1 Drain Bias Voltage for the First Low Noise Amplifier. See Figure 14 for the interface schematic. EPAD Exposed Pad. Connect the exposed pad to RF/dc ground. See Figure 12 for the interface schematic. |
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