HMC8108

Data Sheet

Rev. 0 | Page 4 of 18

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Drain Bias Voltage

LNA_VD1

5.8 V

LNA_VD2

4.8 V

BUFF_VD

4.2 V

Gate Bias Voltage

LNA_VG1

−2 V to + 0.15 V

LNA_VG2

−2 V to + 0.15 V

MIX_VG

−2 V to + 0.15 V

BUFF_VG

−2 V to + 0.15 V

VCTRL

−2 V to + 0.15 V

RF Input Power

20 dBm

LO Input Power

24 dBm

260°C

Maximum Junction Temperature

165°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to 150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Class 0 (150 V)

Field Induced Charged Device Model (FICDM)

Class C3 (250 V)

1

See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

Unit

93

119.47

°C/W

1

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION