MPC755EC datasheet(33/56 Pages) NXP

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

Package Description

7.1

Package Parameters for the MPC745 PBGA

The package parameters are as provided in the following list. The package type is 21

× 21 mm, 255-lead

plastic ball grid array (PBGA).

Package outline

× 21 mm

Interconnects

255 (16

× 16 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.25 mm

Maximum module height

2.80 mm

Ball diameter (typical)

0.75 mm (29.5 mil)

7.2

Mechanical Dimensions for the MPC745 PBGA

Figure 18 provides the mechanical dimensions and bottom surface nomenclature for the MPC745,

255 PBGA package.

Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC745,

255 PBGA Package

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

4. CAPACITOR PADS MAY BE

UNPOPULATED.

Millimeters

DIM

Min

Max

2.25

2.80

0.50

0.70

1.00

1.20

—0.60

0.60

0.90

21.00 BSC

6.75

21.00 BSC

7.87

1.27 BSC

0.2

A1 CORNER

0.2

0.2 C

255X

123456789 10 111213141516

0.3

0.15

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