MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series, Rev. 2.1

6

Freescale Semiconductor

Ordering Information

10

Ordering Information

10.1

Part Numbers Addressed by This Specification

Table 20 provides the ordering information for the MPC755 parts described in this specification.

10.3

Part Marking

Parts are marked as the example shown in Figure 29.

Figure 29. Part Marking for BGA Device

Table 20. Part Numbering Nomenclature

XPC

nnn

B

xx

nnn

x

x

Product

Code

Part

Identifier

Process

Descriptor

Package

Processor

Application Modifier

Revision Level

755

745

B = HiP4DP

PX = PBGA

RX = CBGA

300

350

400

L: 2.0 V ±100 mV

0

° to 105°C

D: 2.7; PVR = 0008 3203

Notes:

1. Processor core frequencies supported by parts addressed by this specification only. Parts addressed by other

specifications may support other maximum core frequencies.

2. The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13.

These are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified

technology to simulate normal production. These parts have only preliminary reliability and characterization data.

Before pilot production prototypes may be shipped, written authorization from the customer must be on file in the

applicable sales office acknowledging the qualification status and the fact that product changes may still occur while

shipping pilot production prototypes.

BGA

MPC755B

RX400LD

MMMMMM

ATWLYYWWA

755

BGA

MPC745B

PX350LD

MMMMMM

ATWLYYWWA

745

CCCCC is the country of assembly. This space is left blank if parts are

MMMMMM is the 6-digit mask number.

ATWLYYWWA is the traceability code.

assembled in the United States.