MCP3564-ESLASHST datasheet(95/108 Pages) MICROCHIP

95 / 108 page

 2019-2021 Microchip Technology Inc.

DS20006181C-page 95

MCP3561/2/4

9.0

PACKAGING INFORMATION

9.1

Package Marking Information(1)

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note 1: In the event the full Microchip part number cannot be marked on one line, it

will be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

2: Denotes the device default SPI Address option. The device only responds to

SPI commands if CMD[7:6] matches the SPI device address for each

command (see Section 6.2.2 “Device Address Bits (CMD[7:6])”). Contact

Microchip Sales for other device address option ordering procedure.

3: The 20-lead TSSOP package allows up to eight characters per line as

shown here. Currently only seven characters are being used as shown in

the example.

Part Number

Code

SPI Device Address

MCP3561T-E/NC

AAA

01(2)

MCP3562T-E/NC

AAB

01(2)

MCP3564T-E/NC

AAC

01(2)

AAA

Example

PIN 1

2112

256

XXX

20-Lead UQFN (3 x 3 x 0.55 mm)

PIN 1

YYWW

NNN

MCP3564

Example

EST 256

2112

XXXXXXXX

XXXXXNNN

YYWW

20-Lead TSSOP (6.5 x 4.4 x 1 mm)(3)

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