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FBS-GAM02-P-R50 Datasheet

Recommended PCB Solder Pad Configuration

The novel I/O “pillar” pads fabricated onto the pad-side

surface of the FBS-GAM02-P-R50 module are designed

to provide optimal electrical, thermal and mechanical

properties for the end-use system designer. To achieve the

full benefit of these properties, it is important that the

FBS-GAM02-P-R50 module be soldered to the PCB

motherboard using SN63 (or equivalent) solder. Care should

be taken during processing to insure there is minimal solder

recommended pad dimensions and locations are shown in

Figure 32. All dimensions are shown in inches.

Figure 32. Recommended PCB Solder

Pad Configuration (Top View)

Preheat Zone – The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the

desired soak temperature. In the preheat zone the temperature of the PCB is constantly rising, at a rate that should not exceed 2.5°C/

sec. The oven’s preheat zone should normally occupy 25-33% of the total heated tunnel length.

Figure 33. Sn63/Pb37 No Clean Solder Paste Typical Reflow Example Profile.

250

200

150

100

50

0

183

< 2.5°C sec

Soak temp 140-160°C

30-120 s

2.0-4.5 min, Slope 0.5°C/sec

0

30

60

90

120

150

180

210

240

270

300

330

360

Peak Temp

Min 205°C Max 225°C

Reflow Time =

60-90 Sec

Soak

Time (Sec)

Preheat

0.710

0.000

0.000

0.185

0.155

0.370

0.340

0.710

0.555

0.525

0.700

0.010

0.620

0.580

0.500

0.460

0.375

0.335

0.250

0.210

0.130

0.090

Sn63/Pb37 No Clean Solder Paste Typical Example Profile