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AIS2IH bảng dữ liệu(PDF) 18 Page - STMicroelectronics

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4
Application hints
Figure 6. AIS2IH electrical connections (top view)
SDA/SDI/SDO
SCL/SPC
10µF
100nF
GND
SDO/SA0
AIS2IH
HOST
I2C / SPI (3/4-w)
SCL
SDA
Vdd_IO
Rpu
Rpu
Pull-up to be added
Rpu=10kOhm
I2C configuration
1
2
11
10
12
5
6
7
3
4
9
8
Vdd_IO
Vdd_IO
100nF
GND
VDD
Vdd
RES
GND
CS
The device core is supplied through the Vdd line while the I/O pads are supplied through the Vdd_IO line. Power
supply decoupling capacitors (100 nF ceramic, 10 µF aluminum) should be placed as near as possible to pin 9 of
the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to
Figure 6). It is possible to remove Vdd while maintaining Vdd_IO without blocking the communication bus, in this
condition the measurement chain is powered off.
The functionality of the device and the measured acceleration data are selectable and accessible through the I²C
or SPI interfaces. When using the I²C, CS must be tied high (i.e. connected to Vdd_IO).
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be completely
programmed by the user through the I²C /SPI interface.
AIS2IH
Application hints
DS12421 - Rev 4
page 18/63



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