LP87702 datasheet(78/98 Pages) TI

78 / 98 page

8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

The LP87702 is a power-management unit including a boost converter, two step-down converters, and three

general-purpose digital output signals.

8.2 Typical Application

SW_B0

VIN_B0

VIN_B1

VANA

VIN

FB_B0

VOUT0

LOAD

SDA (EN3)

SCL (EN2)

nINT

CLKIN (GPO2)

GNDs

EN1

SW_B1

FB_B1

VOUT1

PG0

VMON1

VMON2

PG1 (GPO1)

WDI

WD_RESET

SW_BST

VOUT_BST

VOUT2

LOAD

GPO0

NRST

COUT0

COUT1

COUT2

CIN0

CIN1

CANA

Figure 8-1. LP87702 Typical Application

8.2.1 Design Requirements

Table 8-1. Design Parameters

DESIGN PARAMETER

EXAMPLE VALUE

Input voltage

3.3 V

Output voltages

1.8 V, 1.24 V, 5 V

Switching frequency

4 MHz

8.2.2 Detailed Design Procedure

The performance of the LP87702 device depends greatly on the care taken in designing the printed circuit board

(PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended, while

proper grounding is crucial. Attention should be given to decoupling the power supplies. Decoupling capacitors

must be connected close to the device and between the power and ground pins to support high peak currents

being drawn from the system power rail while turning on the switching MOSFETs. Keep input and output traces

as short as possible, because trace inductance, resistance, and capacitance can easily become the performance

limiting items. The separate buck converter power pins VIN_Bx are not connected together internally. The

VIN_Bx power connections shall be connected together outside the package using a power plane construction.

LP87702

SNVSBU3 – MARCH 2021

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