TMS320F28075PZP datasheet(42/192 Pages) TI

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7.7 Thermal Resistance Characteristics

7.7.1 PTP Package

°C/W(1)

AIR FLOW (lfm)(2)

RΘJC

Junction-to-case thermal resistance

6.97

N/A

RΘJB

Junction-to-board thermal resistance

6.05

N/A

RΘJA (High k PCB)

Junction-to-free air thermal resistance

17.8

RΘJMA

Junction-to-moving air thermal resistance

12.8

150

11.4

250

10.1

500

PsiJT

Junction-to-package top

0.11

0.24

150

0.33

250

0.42

500

PsiJB

Junction-to-board

6.1

5.5

150

5.4

250

5.3

500

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/

JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2)

lfm = linear feet per minute

7.7.2 PZP Package

°C/W(1)

AIR FLOW (lfm)(2)

RΘJC

Junction-to-case thermal resistance

4.3

N/A

RΘJB

Junction-to-board thermal resistance

5.9

N/A

RΘJA (High k PCB)

Junction-to-free air thermal resistance

19.1

RΘJMA

Junction-to-moving air thermal resistance

14.3

150

12.8

250

11.4

500

PsiJT

Junction-to-package top

0.03

0.09

150

0.12

250

0.20

500

PsiJB

Junction-to-board

6.0

5.5

150

5.5

250

5.3

500

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/

JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

TMS320F28076, TMS320F28075

SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021

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