F0452C Datasheet

© 2020 Renesas Electronics Corporation

6

May 5, 2020

Absolute Maximum Ratings

Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other

conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

Table 2.

Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

-0.3

+3.6

V

STBY1, STBY2, ATT1_CTRL, ATT2_CTRL, SW1_CTRL, SW2_CTRL to GND

-0.3

V

SW1_IN, SW2_IN, RX1_OUT, RX2_OUT, SW1_OUT, SW2_OUT to GND

Externally Applied DC Voltage

-50

50

mV

TX Mode CW Average Input Power +7.5dB PAR at SW1_IN, SW2_IN Ports,

10s, 89% Duty Cycle

+31

+33 [b]

dBm

RX Mode Average Input Power +7.5dB PAR at SW1_IN, SW2_IN Ports,

1 Hour Single Event, 50% Duty Cycle

+8

dBm

Storage Temperature Range

-65

+150

°C

Lead Temperature (soldering, 10s)

+260

°C

Electrostatic Discharge – HBM

(JEDEC/ESDA JS-001-2012)

1500

(Class 1C)

V

Electrostatic Discharge – CDM

(JEDEC JS-002-2014)

ALL pins except pins 16, 18, 23, 25

500

(Class C2A)

V

Electrostatic Discharge – CDM

(JEDEC JS-002-2014)

Pins 16, 18, 23, 25

125

(Class C0B)

V

[b] RF input exposures greater than +31dBm and up to +33dBm for multiple extended periods will affect device reliability and lifetime if the maximum

recommended input junction temperature is exceeded.