STM32L021D4 datasheet(108/114 Pages) STMICROELECTRONICS

108 / 114 page

Package information

STM32L021x4

108/114

DocID027982 Rev 5

TSSOP14 device marking

The following figure gives an example of topside marking versus pin 1 position identifier

location.

Other optional marking or inset/upset marks, which depends assembly location, are not

indicated below.

Figure 45. Example of TSSOP14 marking (package top view)

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not yet ready to be used in production and any consequences deriving from such

usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering

samples in production. ST Quality has to be contacted prior to any decision to use these Engineering

samples to run qualification activity.

7.7

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max × ΘJA)

Where:

•

TA max is the maximum ambient temperature in ° C,

•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

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