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RA4M3 bảng dữ liệu(PDF) 28 Page - Renesas Technology Corp

tên linh kiện RA4M3
Giải thích chi tiết về linh kiện  Armv8-M architecture with the main extension
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RA4M3 bảng dữ liệu(HTML) 28 Page - Renesas Technology Corp

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2.2.6
VCC Rise and Fall Gradient and Ripple Frequency
Table 2.9
Rise and fall gradient characteristics
Parameter
Symbol
Min
Typ
Max
Unit
Test
conditions
VCC rising gradient
Voltage monitor 0 reset disabled at startup
SrVCC
0.0084 —
20
ms/V
Voltage monitor 0 reset enabled at startup
0.0084 —
SCI/USB boot mode*1
0.0084 —
20
VCC falling gradient*2
SfVCC
0.0084 —
ms/V
Note 1. At boot mode, the reset from voltage monitor 0 is disabled regardless of the value of the OFS1.LVDAS bit.
Note 2. This applies when VBATT is used.
Table 2.10
Rising and falling gradient and ripple frequency characteristics
The ripple voltage must meet the allowable ripple frequency fr(VCC) within the range between the VCC upper limit (3.6 V) and lower limit (2.7
V). When the VCC change exceeds VCC ±10%, the allowable voltage change rising and falling gradient dt/dVCC must be met.
Parameter
Symbol
Min
Typ
Max
Unit
Test conditions
Allowable ripple
frequency
fr (VCC)
10
kHz
Figure 2.6
Vr (VCC) ≤ VCC × 0.2
1
MHz
Figure 2.6
Vr (VCC) ≤ VCC × 0.08
10
MHz
Figure 2.6
Vr (VCC) ≤ VCC × 0.06
Allowable voltage
change rising and
falling gradient
dt/dVCC
1.0
ms/V
When VCC change
exceeds VCC ±10%
Vr(VCC)
VCC
1 / fr(VCC)
Figure 2.6
Ripple waveform
2.2.7
Thermal Characteristics
Maximum value of junction temperature (Tj) must not exceed the value of “section 2.2.1. Tj/Ta Definition”.
Tj is calculated by either of the following equations.
● Tj = Ta + θja × Total power consumption
● Tj = Tt + Ψjt × Total power consumption
– Tj : Junction Temperature (°C)
– Ta : Ambient Temperature (°C)
– Tt : Top Center Case Temperature (°C)
– θja : Thermal Resistance of “Junction”-to-“Ambient” (°C/W)
RA4M3 Datasheet
2. Electrical Characteristics
R01DS0368EJ0120 Rev.1.20
Dec 2, 2020
Page 28 of 92



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