6.4 Thermal Information

THERMAL METRIC

(1)

ISO672x

UNIT

DWV (SOIC)

8 PINS

Junction-to-ambient thermal resistance

84.3

°C/W

Junction-to-case (top) thermal resistance

36.3

°C/W

Junction-to-board thermal resistance

47.0

°C/W

Junction-to-top characterization parameter

7.4

°C/W

Junction-to-board characterization parameter

45.1

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6720

Maximum power dissipation (both sides)

pF, Input a 25-MHz 50% duty cycle

square wave

71.2

mW

Maximum power dissipation (side-1)

19.3

mW

Maximum power dissipation (side-2)

51.9

mW

ISO6721

Maximum power dissipation (both sides)

pF, Input a 25-MHz 50% duty cycle

square wave

72.7

mW

Maximum power dissipation (side-1)

36.35

mW

Maximum power dissipation (side-2)

36.35

mW

ISO6720-Q1, ISO6721-Q1

SLLSFF5A – JULY 2020 – REVISED DECEMBER 2020

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Product Folder Links: ISO6720-Q1 ISO6721-Q1