TL072CD datasheet(12/69 Pages) TI

12 / 69 page

TL071, TL071A, TL071B

TL072, TL072A, TL072B, TL074, TL074A, TL074B, TL072M, TL074M

SLOS080N – SEPTEMBER 1978 – REVISED JULY 2017

www.ti.com

Product Folder Links: TL071 TL071A TL071B TL072 TL072A TL072B TL074 TL074A TL074B TL072M TL074M

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.8 Thermal Information: TL074x (cont).

THERMAL METRIC(1)

TL074x

UNIT

J (CDIP)

PW (TSSOP)

W (CFP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

—

113

128.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

14.5

—

56.1

°C/W

RθJB

Junction-to-board thermal resistance

—

127.6

°C/W

ψJT

Junction-to-top characterization parameter

—

°C/W

ψJB

Junction-to-board characterization parameter

—

106.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

0.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.9 Thermal Information: TL074x (cont).

THERMAL METRIC(1)

TL074x

UNIT

FK (LCCC)

20 PINS

RθJA

Junction-to-ambient thermal resistance

—

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

5.61

°C/W

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