STM32F722IC datasheet(16/229 Pages) STMICROELECTRONICS

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Description

STM32F722xx STM32F723xx

16/229

DS11853 Rev 6

Operating voltage

1.7 to 3.6 V(8)

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package

LQFP64(9)

LQFP100

WLCSP100(10)

LQFP144

UFBGA144(10)

UFBGA176

LQFP176

1. For the LQFP100 package, only FMC Bank1 is available. Bank1 can only support a multiplexed NOR/PSRAM memory

using the NE1 Chip Select.

2. On the STM32F723xx device packages, except the 176-pin ones, the TIM12 is not available, so there are 9 general-

purpose timers.

3. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio

mode.

4. USB OTG HS with the ULPI on the STM32F722xx devices and with integrated HS PHY on the STM32F723xx devices.

5. The SDMMC2 supports a dedicated power rail for clock, command and data 0..4 lines, feature available starting from 144

pin package.

6. The SDMMC2 is not available on the STM32F723Vx devices.

7. 216 MHz maximum frequency for - 40°C to + 85°C ambient temperature range (200 MHz maximum frequency for - 40°C to

+ 105°C ambient temperature range).

8. VDD/VDDA minimum value of 1.7 V is obtained when the internal reset is OFF (refer to Section 3.15.2: Internal reset OFF).

9. Available only on the STM32F722xx devices.

10. Available only on the STM32F723xx devices.

Table 2. STM32F722xx and STM32F723xx features and peripheral counts (continued)

Peripherals

STM32F72xRx

STM32F72xVx

STM32F72xZx

STM32F72xIx

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