Scotch-Weld

TM

Epoxy Potting Compound/Adhesive

DP270 Clear and Black

Technical Data

March 2019

Product Description

Weld™ Epoxy Potting Compound/Adhesive 270 B/A) is a two-part, low viscosity

epoxy resin system designed primarily for potting, sealing, and encapsulation of

many electronic components and is available in clear or black. 3M™ Scotch-Weld™

epoxy potting compound/adhesive DP270 is noncorrosive to copper and offers good

thermal shock resistance and excellent retention of electrical insulation properties

under high humidity conditions.

3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 has a work life

of approximately 70 minutes, a tack-free time of about 3 hours and is fully cured

after 48 hours at 73°F (23°C). This product produces no exotherm in 5-10 gram

masses and a very slight exotherm in larger masses.

3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is ideal for the

potting and encapsulation of many heat sensitive or delicate components such as

glass diodes and sensors as well as for transformers, coils, chokes, relays, etc. It is

available in the convenient 3M™ EPX Applicator System for multi-station usage

and in bulk containers for larger volume applications.

Available in bulk containers as Scotch-Weld epoxy potting compound/adhesive

270 B/A.

Features

• Good Thermal Shock Resistance

• Excellent Electrical Properties

• Meets UL 94 HB (File No. E61941)

• Noncorrosive to Copper

• Long Worklife

• Negligible Exotherm

Typical Uncured

Properties

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.

Color:

Clear or Black

Base Resin:

Epoxy/amine

Mix Ratio:

1:1 by volume (1:0.85 B:A by weight)

Net Weight:

Lbs./Gal.

Base 9.6 - 9.7

Accelerator 8.0 - 8.2

Worklife:

60-70 minutes @ 23°C (73°F)

Viscosity:

@ 23°C (73°F)

Base

7000 - 16,000 cps

Accelerator

6000 - 12,000 cps