5

TUSB2E22

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SNLS648A – FEBRUARY 2019 – REVISED DECEMBER 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

range

–0.3

4.32

V

Analog Supply

voltage range

–0.3

2.1

V

Voltage range

DPA, DNA, DPB, DNB, 1000 total number of short events and

cummulative duration of 1000 hrs.

–0.3

6

V

Voltage range

eDP0, eDN0, eDP1, eDN1

–0.3

1.6

V

Voltage range

CROSS, RESETB, RSVD1, RSVD2, RSVD3, EQ1, EQ0

–0.3

2.1

V

Junction

temperature

125

°C

Storage

temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±1500

V

Charged device model (CDM), per JEDEC

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (VDD3V3)

3.0

3.3

3.6

V

Analog Supply voltage (VDD1V8)

1.62

1.8

1.98

V

Operating free-air temperature

-20

85

°C

Junction temperature

-20

105

°C

Case temperature

-20

105

°C

PCB temperature (1mm away from the device)

-20

92

°C