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VSC8504-02 bảng dữ liệu(PDF) 126 Page - Microsemi Corporation

tên linh kiện VSC8504-02
Giải thích chi tiết về linh kiện  Quad-Port 10/100/1000BASE-T PHY with Synchronous Ethernet and QSGMII/SGMII MAC
PDF  131 Pages
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nhà sản xuất  MICROSEMI [Microsemi Corporation]
Trang chủ  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VSC8504-02 bảng dữ liệu(HTML) 126 Page - Microsemi Corporation

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Package Information
VMDS-10507 VSC8504-02 Datasheet Revision 4.2
115
PCB). For more information about the thermal measurement method used for this device, see the
JESD51-1 standard.
To achieve results similar to the modeled thermal measurements, the guidelines for board design
described in the JESD51 family of publications must be applied. For information about applications using
BGA packages, see the following:
•
JESD51-2A, Integrated Circuits Thermal Test Method Environmental Conditions, Natural Convection
(Still Air)
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions, Forced Convection
(Moving Air)
•
JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions, Junction-to-Board
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
7.3
Moisture Sensitivity
This device is rated moisture sensitivity level 4 as specified in the joint IPC and JEDEC standard
IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
Table 135 •
Thermal Resistances
Symbol
°C/W
Parameter
θJCtop
5.9
Die junction to package case top
θJB
12.7
Die junction to printed circuit board
θJA
22
Die junction to ambient
θJMA at 1 m/s
18.5
Die junction to moving air measured at an air speed of 1 m/s
θJMA at 2 m/s
16.3
Die junction to moving air measured at an air speed of 2 m/s



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