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VSC8504-02 bảng dữ liệu(PDF) 125 Page - Microsemi Corporation

tên linh kiện VSC8504-02
Giải thích chi tiết về linh kiện  Quad-Port 10/100/1000BASE-T PHY with Synchronous Ethernet and QSGMII/SGMII MAC
PDF  131 Pages
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nhà sản xuất  MICROSEMI [Microsemi Corporation]
Trang chủ  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VSC8504-02 bảng dữ liệu(HTML) 125 Page - Microsemi Corporation

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Package Information
VMDS-10507 VSC8504-02 Datasheet Revision 4.2
114
Figure 51 •
Package Drawing
7.2
Thermal Specifications
Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These
documents are available on the JEDEC Web site at www.jedec.org. The thermal specifications are
modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p
0.20 (4×)
X
Y
17.00
Pin A1 corner
17.00
1.00
1.00
A
1
2
3
4
5
6
7
9
10
11
12
14
15
16
13
B
H
J
K
L
M
N
P
R
T
8
D
C
E
F
G
15.00
15.00
Pin A1 corner
0.25 Z
0.20 Z
Z
Ø 0.25
Ø 0.10 M
MZ X Y
Z
Seating plane
Ø 0.45–0.64
5
4
Top View
Bottom View
Side View
Notes
1. All dimensions and tolerances are in millimeters (mm).
2. Ball diameter is 0.50 mm.
3. Radial true position is represented by typical values.
4. Primary datum Z and seating plane are defined by the
spherical crowns of the solder balls.
5. Dimension is measured at the maximum solder ball
diameter, parallel to primary datum Z.



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