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SSM3K44MFV bảng dữ liệu(PDF) 2 Page - Toshiba Semiconductor

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SSM3K44MFV
2018-05-17
2
Electrical Characteristics (Ta
= 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±14 V, VDS = 0 V
±
1
µ
A
Drain-source breakdown voltage
V (BR) DSS
ID = 0.1 mA, VGS = 0 V
30
V
Drain cut-off current
IDSS
VDS = 30 V, VGS = 0 V
1
µ
A
Gate threshold voltage
Vth
VDS = 3 V, ID = 0.1 mA
0.8
1.5
V
Forward transfer admittance
Yfs
VDS = 3 V, ID = 10 mA
25
mS
Drain-Source on-resistance
RDS (ON)
ID = 10 mA, VGS = 4 V
2.2
4.0
Ω
ID = 10 mA, VGS = 2.5 V
4.0
7.0
Input capacitance
Ciss
VDS = 3 V, VGS = 0 V, f = 1 MHz
8.5
pF
Reverse transfer capacitance
Crss
5.3
Output capacitance
Coss
9.4
Switching time
Turn-on time
ton
VDD = 5 V, ID = 10 mA,
VGS = 0 to 5 V
50
ns
Turn-off time
toff
200
Switching Time Test Circuit
(a) Test circuit
(b) VIN
Precaution
Vth can be expressed as the voltage between gate and source when the low operating current value is ID = 100 µA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth.
(The relationship can be established as follows: VGS (off) < Vth < VGS (on) )
Please take this into consideration when using the device.
(c) VOUT
ton
90%
10%
0 V
5 V
10%
90%
toff
tr
tf
VDD
VDS (ON)
VDD = 5 V
Duty ≤ 1%
Input: tr, tf < 5 ns
(Zout = 50 Ω)
Common Source
Ta = 25°C
VDD
Output
Input
5 V
0
10 µs
RL



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