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GD5F1GQ4UFFFG bảng dữ liệu(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD5F1GQ4UFFFG bảng dữ liệu(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc. |
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48 / 50 page ![]() SPI(x1/x2/x4) NAND Flash 1G 48 23 REVISION HISTORY Version No Description Date Page 1.0 Initial Release 2017-4-21 1.1 Add reset function description ch13.2 2017-5-9 1.2 Add RESET# pin on Connection Diagram ch2.2 2017-5-22 1.3 Update LGA8 package POD figure and size Separate 1Gb/2Gb datasheet Remove Hardware reset function. Remove RESET# pin on Connection Diagram 2017-6-14 1.4 Modify Package WSON8 (6*8mm) 2017-7-20 1.5 Modify the Number of Figure and Table Modify Package ‘R’ description 2017-9-1 1.6 Add the Note article 4 of Page Program 2017-10- 23 1.7 Add the chapter of Valid Part Numbers 2017-11-3 1.8 Add the description of 1Gb SLC NAND Flash Add the description of Reliability Delete Valid Part Number of GD5F1GQ4U9IG Modify the Figure of Program Load Sequence Diagram typo Modify the package of LGA8 2017-12- 11 1.9 Modify the package of WSON8,SOP16 300mil,TFBGA24 Modify the typo of LGA8 2017-12- 27 2.0 Modify some typo Add Temperature Range J:Industrial(-40 ℃ to 105℃) and related description Change Memory Mapping CA from<12:0> to <11:0> Add byte1 and byte2 for two Device ID in Read Sequence Diagram Add page size 2048bytes + 64bytes with ECC enabled Modify figures11-1,11-2,11-4,11-5,11-6 from Byte 2175 to 2175/2111 and add a note to explain Merge chapters 2.1 and 21.1 Change the description of protection with WP# Pin 2018-2-13 2.1 Add Temperature Range F:Industrial+ (-40 ℃ to 85℃) 2018-3-12 2.2 Modify the Value of Applied Input/ Output Voltage and VCC in Chapter16 Modify the description of LGA8 6*8mm package Update Ordering Information 2018-7-25 2.3 Modify the file name Update Ordering Information 2018-10- 18 2.4 Add Note describe the spare size with Internal ECC ON. Add the Array Organization with Internal ECC ON. Add Note of Address with Internal ECC ON. 2019-3-22 4/9 9 35 |
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