ZXLD1370

Document number: DS32165 Rev. 6 - 2

4 of 40

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December 2016

© Diodes Incorporated

ZXLD1370

Symbol

Parameter

Rating

Unit

Input Supply Voltage Relative to GND

-0.3 to +65

V

Auxiliary Supply Voltage Relative to GND

-0.3 to +65

V

Current Monitor Input Relative to GND

-0.3 to +65

V

-0.3 to +5

V

Gate Driver Output Voltage

-0.3 to +20

V

Gate Driver Continuous Output Current

18

mA

Flag Output Voltage

-0.3 to 40

V

Other Input Pins

-0.3 to +5.5

V

Maximum Junction Temperature

150

°C

Storage Temperature

-55 to +150

°C

Caution:

Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be

affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and

transporting these devices.

Package Thermal Data

Thermal Resistance

Package

Typical

Unit

Junction-to-

TSSOP-16EP

50

°C/W

Junction-to-

TSSOP-16EP

23

°C/W

Notes:

5. For correct operation SGND and PGND should always be connected together.

6. Measured on High Effective Thermal Conductivity Test Board" according JESD51.