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HSDL-3003 bảng dữ liệu(PDF) 11 Page - Agilent(Hewlett-Packard)

tên linh kiện HSDL-3003
Giải thích chi tiết về linh kiện  IrDA Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver
PDF  21 Pages
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nhà sản xuất  HP [Agilent(Hewlett-Packard)]
Trang chủ  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-3003 bảng dữ liệu(HTML) 11 Page - Agilent(Hewlett-Packard)

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11
Moisture Proof Packaging
All HSDL-3003 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
Package
Temp.
Time
In reels
60
°C
≥ 48 hours
In bulk
100
°C
≥ 4 hours
125
°C
≥ 2 hours
150
°C
≥ 1 hour
Baking should only be done once.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Recommended Storage Conditions
Storage Temperature 10
°C to 30°C
Relative Humidity
below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
Figure 14. Baking conditions chart.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
PACKAGE IS
OPENED MORE
THAN 72 HOURS?
PERFORM RECOMMENDED
BAKING CONDITIONS
NO BAKING
IS NECESSARY
YES
NO
YES
NO



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