LM358ADE4 datasheet(7/47 Pages) TI1

7 / 47 page

LM158, LM158A, LM258, LM258A

LM358, LM358A, LM358B, LM2904, LM2904B, LM2904V

www.ti.com

SLOS068V – JUNE 1976 – REVISED SEPTEMBER 2018

Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM358B LM2904 LM2904B LM2904V

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7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, VS= ([V+] – [V–])

LM358B, LM358BA, LM2904B,

LM2904BA

LM158, LM258, LM358, LM158A,

LM258A, LM358A, LM2904V

LM2904

VCM

Common-mode voltage

V–

VS – 2

Operating ambient temperature

LM358B, LM358BA

–40

°C

LM2904B, LM2904BA, LM2904,

LM2904V

–40

125

LM358, LM358A

LM258, LM258A

–20

LM158, LM158A

–55

125

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

For a listing of which devices are available in what packages, see Device Comparison Table

7.4 Thermal Information

THERMAL METRIC(1)

LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904,

LM2904B, LM2904BA, LM2904V(2)

LM158, LM158A

UNIT

(SOIC)

DGK

(VSSOP)

(PDIP)

(SO)

(TSSOP)

(LCCC)

(CDIP)

8 PINS

20 PINS

8 PINS

RθJA

Junction-to-ambient thermal

resistance

124.7

181.4

80.9

116.9

171.7

—

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

66.9

69.4

70.4

62.5

68.8

5.61

14.5

°C/W

RθJB

Junction-to-board thermal

resistance

67.9

102.9

57.4

68.6

99.2

—

°C/W

ψJT

Junction-to-top

characterization parameter

19.2

11.8

21.9

11.5

—

°C/W

ψJB

Junction-to-board

characterization parameter

67.2

101.2

56.9

67.6

97.9

—

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

—

12.1

—

°C/W

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