LPA2164ASOF datasheet(12/15 Pages) POWER

12 / 15 page

Preliminary Datasheet

LPA2164A

LPA2164A–00

Version 1.0 May.-2013

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 12 of 15

PCB Layout notices

1, In the path of the power supply, plus a 1uF and a 10uF

to ground high-frequency filter capacitor. These caps can

be connected to the thermal pad directly for an excellent

ground connection. Consider adding a small, good quality

low ESR ceramic capacitor may achieve better sound

effects.

2, Large (470 µF or greater) bulk power supply

decoupling capacitors should be placed near the

LPA2164A on the VDD supplies. Local, high-frequency

bypass capacitors should be placed as close to the VDD

pins as possible.

3, The power line, ground line and filter capacitor and

bypass capacitors as close to the chip's pins, remember

not to put the capacitor on the back of the board, through

tiny holes through the jumper even over. Keep the current

loop from each of the outputs through the ferrite bead

and the small filter cap and back to PGND as small and

tight as possible. The size of this current loop determines

its effectiveness as an antenna.

4, Power, ground, and a large current line must try to be

wide enough, if you want to add vias, the number of

through-holes must be at least 6. The thermal pad must

be soldered to the PCB for proper thermal performance

and optimal reliability.

5, GND and VDD should be put independently,

high-power signals to avoid interference.

6, If you want to pursue as large as the effect of power, a

large selection of speakers or sound chamber with low

resistance (such as 3.6Ù) speakers, or added to improve

the supply voltage boost circuit.

7, Including the line between large current cell and chip,

the inductor should be as close and short as possible to

chip for a high performance. Adding a coil to this pin

would be helpful for EMI certification. If there is a high

standards needed in LPA2164A application, we could

add a coil and capacitor between chip and speaker

constituting a LC filter which coil would be 100MHz,

100~150Ω and its DCI beyond 3A placing as close as

possible to chip, the capacitor should be 1nF connecting

the PGND.

8, The position under the amplifier chip on the board

must be added vents and large areas of exposed copper

and tin to enhance heat dissipation.

9, In case of fixed gain and meeting demand, it should

make CIN small as possible as we can because it

constitute a high through filter with Rin which cutoff

frequency is 1/2*3.414*Cin*Rin. A high capacitance cap

could make POP worse.

PCB LAYOUT

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