5

TUSB1002A

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SLLSF63 – MARCH 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

Range

-0.3

4

V

Voltage Range

on I/O pins

Differential voltage for RX1P/N and RX2P/N

-2.5

2.5

V

Voltage at RX pins

-0.5

4

V

Voltage on Control pins

-0.5

4

V

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±5000

V

Charged device model (CDM), per JEDEC

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

100

mV

TUSB1002A Ambient temperature

0

70

°C

TUSB1002AI Ambient temperature

-40

85

°C

TUSB1002A Junction temperature

0

105

°C

TUSB1002AI Junction temperature

-40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TUSB1002A

UNIT

RGE (VQFN)

24 PINS

Junction-to-ambient thermal resistance

38.5

°C/W

Junction-to-case (top) thermal resistance

41.6

°C/W

Junction-to-board thermal resistance

16.3

°C/W

Junction-to-top characterization parameter

1.0

°C/W

Junction-to-board characterization parameter

16.4

°C/W

Junction-to-case (bottom) thermal resistance

6.9

°C/W