CYUSB3314 datasheet(38/43 Pages) CYPRESS

38 / 43 page

CYUSB330x/CYUSB331x

CYUSB332x/CYUSB230x

Document Number: 001-73643 Rev. *R

Page 38 of 43

Figure 20. 100-Ball BGA (6.0 × 6.0 × 1.0 mm) BZ100 Package Outline

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW

DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE

SOLDER BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

0.25

0.25 BSC

0.50 BSC

0.30

100

0.35

DIMENSIONS

SYMBOL

0.16

MIN.

4.50 BSC

6.00 BSC

NOM.

1.00

MAX.

0.25 BSC

100XØb

Ø0.15

Ø0.05 M

TOP VIEW

BOTTOM VIEW

SIDE VIEW

A1 CORNER

0.10

JEDEC SPECIFICATION NO. REF. : MO-195C.

0.10

0.08 C

0.10 C

DETAIL A

(datum A)

(datum B)

DETAIL A

METALIZED MARK, INDENTATION OR OTHER MEANS.

"SD" = eD/2 AND "SE" = eE/2.

PARALLEL TO DATUM C.

"SD" OR "SE" = 0.

SIZE MD X ME.

A1 CORNER

BALLS.

51-85209 *F

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