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LPS33HW bảng dữ liệu(PDF) 23 Page - STMicroelectronics

tên linh kiện LPS33HW
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LPS33HW bảng dữ liệu(HTML) 23 Page - STMicroelectronics

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LPS33HW
Application hints
50
5
Application hints
Figure 13. LPS33HW electrical connections (top view)
The device power supply must be provided through the VDD line; a power supply
decoupling capacitor C1 (100 nF) must be placed as near as possible to the supply pads of
the device. Depending on the application, an additional capacitor of 4.7 μF could be placed
on the VDD line.
The functionality of the device and the measured data outputs are selectable and accessible
through the I²C/SPI interface. When using the I2C, CS must be tied to Vdd_IO.
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 13). It is possible to remove VDD while maintaining
Vdd_IO without blocking the communication bus, in this condition the measurement chain is
powered off.
5.1
Soldering information
The CCLGA package is compliant with the ECOPACK® standard and it is qualified for
soldering heat resistance according to JEDEC J-STD-020.



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