ATSAMB11XR datasheet(74/87 Pages) MICROCHIP

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15.

Reflow Profile Information

This section provides guidelines for the reflow process in soldering the ATSAMB11-XR2100A or the

ATSAMB11-ZR210CA to the customer’s design.

15.1

Storage Condition

15.1.1

Moisture Barrier Bag Before Opening

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.

The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.

15.1.2

Moisture Barrier Bag Open

Humidity indicator cards must be blue, < 30%.

15.2

Stencil Design

The recommended stencil is a laser-cut, stainless-steel type with a thickness of 75 µm to 100 µm and

approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper

with bottom opening 25 µm larger than the top can be utilized. Local manufacturing experience may find

other combinations of stencil thickness and aperture size to get good results.

15.3

Soldering and Reflow Conditions

15.3.1

Reflow Oven

It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen

atmosphere be used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability

and reduce temperature gradient across the board. It can also enhance the appearance of the solder

joints by reducing the effects of oxidation.

The following items should also be observed in the reflow process:

Some recommended pastes include

•

NC-SMQ

® 230 flux and Indalloy® 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu

•

SENJU N705-GRN3360-K2-V Type 3, no clean paste.

Allowable reflow soldering iterations:

•

Three times based on the following reflow soldering profile (see Figure 15-1).

Temperature profile:

•

Reflow soldering shall be done according to the following temperature profile (see Figure 15-1).

•

Peak temperature: 250°C.

15.4

Baking Conditions

This module is rated at MSL level 3. After sealed bag is opened, no baking is required within 168 hours

so long as the devices are held at <= 30°C/60% RH or stored at <10% RH.

The module will require baking before mounting if:

ATSAMB11XR/ZR

Datasheet Preliminary

DS70005342A-page 74

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