FEATURES
10 x 10 mm to 32 x 32 mm body size
44-240 lead counts
Custom leadframe design available
Die up and down configurations
High conductivity copper leadframes
JEDEC standard compliant package outlines
Integrated thermal enhancement available with heat spreader
Fine pitch wirebond capability
Pb-free material sets

APPLICATIONS
Amkor’s MQFP line is adapted to meet the increasing challenges of advanced Digital Signal Processors (DSP), microcontrollers, ASIC, gate arrays (FPGA/PLD), and other technologies. These packages fill application needs in commercial, office, industrial and other product areas.