Features
Glass passivated chip junction in DO-15 Package
Low leakage
Uni and Bidirectional unit
Excellent clamping capability
500W Peak power capability at 10 × 1000μs waveform Repetition
rate (duty cycle):0.01%
Fast response time: typically less than 1.0ps from 0 Volts to VBR min
Typical IR less than 5μA above 8V
High Temperature soldering: 260°C/40 seconds at terminals
Typical maximum temperature coefficient
ΔVBR = 0.1% × VBR@25°C× ΔT
Plastic package has Underwriters Laboratory Flammability 94V-0
Matte tin lead–free Plated
Halogen free and RoHS compliant
Typical failure mode is short from over-specified voltage or current
Whisker test is conducted based on JEDEC JESD201A per its table
4a and 4c
IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
ESD protection of data lines in accordance with
IEC 61000-4-2 (IEC801-2)
EFT protection of data lines in accordance with
IEC 61000-4-4 (IEC801-4)