Features
♦ Glass passivated chip junction in DO-15 Package
♦ Low leakage
♦ Uni and Bidirectional unit
♦ Excellent clamping capability
♦ 600W Peak power capability at 10 × 1000µs waveform Repetition rate (duty cycle):0.01%
♦ Fast response time: typically less than 1.0ps from 0 Volts to VBR min
♦ Typical IR less than 5μA above 12V.
♦ High Temperature soldering: 260°C/40 seconds at terminals
♦ Typical maximum temperature coefficient ΔVBR = 0.1% × VBR@25°C× ΔT
♦ Plastic package has Underwriters Laboratory Flammability 94V-0
♦ Matte tin lead–free Plated
♦ Halogen free and RoHS compliant
♦ Typical failure mode is short from over-specified voltage or current
♦ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
♦ IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
♦ ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)
♦ EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)