| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
 NXP Semiconductors |
MF1ICS2005
|
90Kb/7P |
Sawn bumped 120關m wafer addendum
Rev. 3.0 - 18 July 2007 |
|
MF1ICS2005U7D
|
90Kb/7P |
Sawn bumped 120關m wafer addendum
Rev. 3.0 - 18 July 2007 |
|
MF1ICS2005W7D
|
90Kb/7P |
Sawn bumped 120關m wafer addendum
Rev. 3.0 - 18 July 2007 |
|
MF1ICS50
|
326Kb/20P |
Functional specification Public transportation
Rev. 5.6-24 November 2010 |
|
MF1ICS5005
|
35Kb/7P |
Standard Card IC Specification ?쐀umped sawn wafer on UV-tape?
August 2004 |
|
MF1ICS5005V1D
|
35Kb/7P |
Standard Card IC Specification ?쐀umped sawn wafer on UV-tape?
August 2004 |
|
MF1ICS5005W1D
|
35Kb/7P |
Standard Card IC Specification ?쐀umped sawn wafer on UV-tape?
August 2004 |
|
MF1ICS50
|
326Kb/20P |
Functional specification Public transportation
Rev. 5.6-24 November 2010 |
|
MF1ICS70
|
334Kb/20P |
Functional specification Public transportation
Rev. 4.4-25 November 2010 |
|
MF1ICS7001
|
293Kb/7P |
Standard 4Kbyte card IC sawn wafer on UV-tape addendum
Rev. 3.1-18 April 2007 |
|
MF1ICS70
|
334Kb/20P |
Functional specification Public transportation
Rev. 4.4-25 November 2010 |