| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
 Advanced Thermal Soluti... |
ATS-1039-C1-R0_DS
|
2Mb/1P |
maxiFLOW™ Cross Cut High Performance Heat Sinks with Plastic Push Pin
REV1_0908 |
|
ATS-1109-C1-R0
|
339Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-1139-C1-R0
|
327Kb/1P |
Hole pattern fits standard quarter power brick modules
REV4_0117 |
|
ATS-1149-C1-R0
|
330Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-1179-C1-R0
|
321Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-56009-C1-R0
|
396Kb/1P |
Comes preassembled with high performance thermal interface material
Rev - 040517 |
|
ATS-59009-C1-R0
|
118Kb/1P |
Designed for flip-chip processors such as NXP MPCs
Rev - 230517 |