| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
 Advanced Thermal Soluti... |
ATS-1041-C1-R0_DS
|
2Mb/1P |
maxiFLOW™ Cross Cut High Performance Heat Sinks with Plastic Push Pin
REV1_0908 |
|
ATS-1111-C1-R0
|
346Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-1141-C1-R0
|
337Kb/1P |
Hole pattern fits standard quarter power brick modules
REV4_0117 |
|
ATS-1151-C1-R0
|
448Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-1181-C1-R0
|
326Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-56001-C1-R0
|
415Kb/1P |
High Performance ASIC Cooling Solutions w/Thermal Tape Attachment
Rev - 121101 |
|
ATS-56001-C1-R0
|
315Kb/1P |
Designed specifically for ASIC package and their unique cooling requirements
Rev - 040517 |
|
ATS-56011-C1-R0
|
345Kb/1P |
Comes preassembled with high performance thermal interface material
Rev - 040517 |
|
ATS-59001-C1-R0
|
133Kb/1P |
Designed for flip-chip processors such as NXP MPCs
Rev - 230517 |
|
ATS-60001-C1-R0
|
302Kb/1P |
Designed for high performance in low air velocities
Rev - 040517 |