MDP01 datasheet(2/5 Pages) VISHAY

2 / 5 page

MDP 01, 03, 05

www.vishay.com

Vishay Dale

Revision: 12-Sep-13

Document Number: 31511

For technical questions, contact: ff2aresistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS in inches (millimeters)

Note

• For additional impedance codes, refer to the Dual Terminator Impedance Code Table document (www.vishay.com/doc?31530).

GLOBAL MODEL

MDP 14

0.750 (19.05)

0.600 (15.24)

MDP 16

0.850 (21.59)

0.700 (17.78)

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

MDP14

MDP16

Package Power Rating (Maximum at +70 °C)

1.73

1.92

Voltage Coefficient of Resistance

Veff

< 50 ppm typical

Dielectric Strength

VAC

200

Insulation Resistance



> 10 000M minimum

Operating Temperature Range

°C

-55 to +125

Storage Temperature Range

°C

-55 to +150

MECHANICAL SPECIFICATIONS

Marking Resistance to Solvents

Permanency testing per MIL-STD-202, method 215

Solderability

Per MIL-STD-202, method 208E

Body

Molded epoxy

Terminals

Solder plated leads

Weight

14 pin = 1.3 g; 16 pin = 1.5 g

IMPEDANCE CODES

CODE

R1 ()

R2 ()CODE

R1 ()

R2 ()

500B

130

141A

270

750B

120

200

181A

330

390

800C

130

210

191A

330

470

990A

160

260

221B

330

680

101C

180

240

281B

560

111C

180

270

381B

560

1.2K

121B

180

390

501C

620

2.7K

121C

220

270

102A

1.5K

3.3K

131A

220

330

202B

6.2K

0.010 + 0.005

- 0.002

(0.254 + 0.127

- 0.051)

0.250

± 0.005

(6.35

± 0.127)

0.310

± 0.010

(7.87

± 0.254)

0.290 Min.

0.320 Nom.

0.360 Max.

(7.37 Min.

8.13 Nom.

9.14 Max.)

Pin #1

Non-Accumulative Tol.

"C" Spaces

± 0.010 (0.254)

0.030

(0.762) Typ.

0.100

± 0.010

(2.54

± 0.254)

0.075

± 0.015

(1.90

± 0.381)

0.120

± 0.005

(3.05

± 0.127)

0.130 + 0.015

- 0.010

(3.30 + 0.381

- 0.254)

0.050

± 0.005

(1.27

± 0.127)

0.018

± 0.003

(0.457

± 0.076)

± 0.010 (0.254)

Pin #1

Identification

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