Connection Diagrams

10-Bump micro SMD Package

10-Bump micro SMD Package

20040902

Top View

20040903

Bottom View

Ordering Information

Order Number

Package Type

NSC Package

Marking (*)

Supplied As

LM2706TL

10-Bump Wafer

Level Chip Scale

(micro SMD)

XYTT IS64B

250 Tape and Reel

LM2706TLX

3000 Tape and Reel

(*) XY - denotes the date code marking (2 digit) in production

TT - refers to die run/lot traceability for production

I - pin one indication

S - Product line designator

Note the Package Marking may change over the course of production without notice

Pin Description

Pin

Number

Pin Name

Function

A1

V

DD

Analog Supply Input. If board layout is not optimum, an optional 0.1 µF ceramic capacitor is

suggested (Figure 1).

B1

V

CON

Voltage Control Analog Input. V

V

CON

≤ 0.55V for V

V

CON

≥ 1.7V for V

C1

ABD

Automatic Bypass Disable. Use this digital input to control Automatic Bypass mode. Set:

ABD = low to enable automatic bypass mode

ABD = high to disable automatic bypass mode

D1

BYP

Bypass. Use this digital input to command operation in Forced Bypass mode. Set BYP = 0V

for normal operation.

D2

EN

Enable Input. Set this digital input high for normal operation. For shutdown, set low.

D3

PGND

Power Ground

C3

SW

Switching Node connection to the internal PFET switch and NFET synchronous rectifier.

B3

PV

IN

Power Supply Voltage Input to the internal PFET switch. Connect to the input filter capacitor

(Figure 1).

A3

FB

Feedback Analog Input. Connect to the output at the output filter capacitor (Figure 1).

A2

SGND

Analog and Control Ground

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