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PixArt Imaging Inc.

PAH8011ES Product Datasheet

Low Power Heart Rate Monitor Optical Chip

Version 1.1 | 20 Oct 2017 | 31008AEN

PixArt Imaging Inc. http://www.pixart.com

All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission.

Contents

PAH8011ES: Low Power Heart Rate Monitor Optical Chip........................................................................................................ 1

General Description ............................................................................................................................................................ 1

Key Features ....................................................................................................................................................................... 1

Applications ........................................................................................................................................................................ 1

Key Parameters ................................................................................................................................................................... 1

Ordering Information.......................................................................................................................................................... 1

List of Figures........................................................................................................................................................................... 4

List of Tables ............................................................................................................................................................................ 5

Introduction................................................................................................................................................................. 6

1.1

Overview ................................................................................................................................................................. 6

1.2

Terminology ............................................................................................................................................................ 6

1.3

Signal Description .................................................................................................................................................... 7

1.4

Chip Array................................................................................................................................................................ 7

1.5

ADC Normalized Mode ............................................................................................................................................ 7

1.6

Power Saving Mechanism........................................................................................................................................ 7

Operating Specifications .............................................................................................................................................. 8

2.1

Absolute Maximum Ratings..................................................................................................................................... 8

2.2

Recommended Operating Conditions ..................................................................................................................... 8

2.3

Thermal Specifications ............................................................................................................................................ 9

2.4

DC Characteristics.................................................................................................................................................... 9

2.5

AC Characteristics.................................................................................................................................................. 10

Mechanical Specifications .......................................................................................................................................... 11

3.1

Mechanical Dimension .......................................................................................................................................... 11

3.2

Package Marking ................................................................................................................................................... 12

System Design............................................................................................................................................................ 13

4.1

System Overview ................................................................................................................................................... 13

4.2

Reference Schematic............................................................................................................................................. 16

4.3

Design Guidelines .................................................................................................................................................. 17

4.4

Recommended Guidelines for PCB Assembly........................................................................................................ 19

4.5

Package Information ............................................................................................................................................. 20

Power States & Sequence .......................................................................................................................................... 21

5.1

Power States.......................................................................................................................................................... 21

5.2

Power-up and Power-off Sequence....................................................................................................................... 21

I2C Serial Interface Communication............................................................................................................................ 21

6.1

Signal Description .................................................................................................................................................. 21

6.2

Start and Stop of Synchronous Operation ............................................................................................................. 21