01.08.2012

LED565/660-04A

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Precaution for Use

1.

Cautions

•

DO NOT look directly into the emitting area of the LED or through the optical system during operation!

To prevent in adequate exposure of the radiation, wear protective glasses.

2.

Lead Forming

•

Lead forming should be done before soldering.

•

When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead.

DO NOT use the base of the lead frame as a fulcrum during lead forming!

•

DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the

LED’s characteristics or it may break the LEDs.

•

When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be

exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes

deterioration of the lead and it will degrade the LEDs.

3.

Soldering Conditions

•

Solder the LEDs no closer than 3 mm from the base of the

lead.

•

DO NOT apply any stress to the lead particularly when heat.

•

After soldering the LEDs, the lead should be protected from

mechanical shock or vibration until the LEDs return to room

temperature.

•

The LEDs must not be reposition after soldering.

•

When it is necessary to clamp the LEDs to prevent soldering

failure, it is important to minimize the mechanical stress on the

LEDs.

•

Cut the LED leads at room temperature. Cutting the leads at

high temperature may cause the failure of the LEDs.

Soldering Conditions

4.

Static Electricity

•

The LEDs are very sensitive to Static Electricity and surge

voltage. So it is recommended that a wrist band and/or an anti-

electrostatic glove be used when handling the LEDs.

•

All devices, equipment and machinery must be grounded

properly. It is recommended that precautions should be taken

against surge voltage to the equipment that mounts the LEDs.