LC72717PW

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2

Specifications

Parameter

Symbol

Conditions

Ratings

Unit

Maximum supply voltage

VDD

0.3 to +4.0

V

Input voltage

VIN1

A0/CL, A1/CE, A2/DI, RST, STNBY

(VDD is equal to 2.7 V or more.)

0.3 to +5.6

V

A0/CL, A1/CE, A2/DI, RST, STNBY

(VDD is less than 2.7 V.)

0.3 to VDD+0.3

V

VIN2

Input pin other than VIN1

0.3 to VDD+0.3

V

Output voltage

VOUT

Output pin

0.3 to VDD+0.3

V

Output current

IOUT1

INT, RDY, DREQ, D0 to D15, DO

0 to 2.0

mA

IOUT2

Output pin other than IOUT1

0 to 1.0

mA

Allowable output current (total)

ITTL

Total for all the output pins

10

mA

Allowable power dissipation

Pd max

200

mW

Operating temperature

Topr

Ta

 85C

40 to +85

C

Storage temperature

Tstg

55 to +125

C

Parameter

Symbol

Pin Name

Type

Conditions

Ratings

unit

min

typ

max

Supply voltage

VDD

2.7

3.6

V

Input high-level

voltage

VIH1

A0/CL, A1/CE, A2/DI,

RST, STNBY

Schmitt

0.7VDD

5.5

V

VIH2

IOCNT1, IOCNT2,

DACK, D0, D1, D2, D3,

D4, D5, D6, D7, WR,

RD, A3, CS

Schmitt

0.7VDD

VDD

V

VIH3

SP, BUSWD, TIN,

TPC1, TPC2, TOSEL1,

TOSEL2

0.7VDD

VDD

V

Input low-level

voltage

VIL1

A0/CL, A1/CE, A2/DI,

RST, STNBY

Schmitt

0.0

0.3VDD

V

VIL2

IOCNT1, IOCNT2,

DACK, D0, D1, D2, D3,

D4, D5, D6, D7, WR,

RD, A3, CS

Schmitt

0.0

0.3VDD

V

VIL3

SP, BUSWD, TIN,

TPC1, TPC2, TOSEL1,

TOSEL2

0.0

0.3VDD

V

Oscillation

frequency

FOSC

XIN, XOUT

Oscillation

circuit

Within

250 ppm

7.2

MHz

XIN input

sensitivity

VXI

XIN

Capacitive

coupling

400

mVrms

Input amplitude

VMPX1

MPXIN

SCF

100%

demodulation

composite

VDD = 3.3 V

120

500

mVrms

VMPX2

MPXIN

SCF

100%

demodulation

composite

VDD = 2.7 V

120

450

mVrms

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,

damage may occur and reliability may be affected.

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended

Operating Ranges limits may affect device reliability.