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Supply Voltage

a

Output Voltage

a

Output Current

10 mA

Storage Temperature

TO-46 Package

b

TO-92 Package

b

SO-8 Package

b

ESD Susceptibility (Note 11)

800V

Lead Temp

TO-46 Package (Soldering 10 seconds)

a

300 C

TO-92 Package (Soldering 10 seconds)

a

260 C

SO Package (Note 12)

Vapor Phase (60 seconds)

215 C

Infrared (15 seconds)

220 C

Specified Operating Temp Range (Note 2)

LM34 LM34A

b

LM34C LM34CA

b

LM34D

a

LM34A

LM34CA

Parameter

Conditions

Tested

Design

Tested

Design

Units

Typical

Limit

Limit

Typical

Limit

Limit

(Max)

(Note 4)

(Note 5)

(Note 4)

(Note 5)

Accuracy (Note 7)

g

04

g

10

g

04

g

10

F

g

06

g

06

g

20

F

g

08

g

20

g

08

g

20

F

g

08

g

20

g

08

g

30

F

Nonlinearity (Note 8)

g

035

g

07

g

030

g

06

F

Sensor Gain

a

100

a

99

a

100

a

99

mV F min

(Average Slope)

a

101

a

101

mV F max

Load Regulation

g

04

g

10

g

04

g

10

mVmA

(Note 3)

g

05

g

30

g

05

g

30

mVmA

Line Regulation (Note 3)

g

001

g

005

g

001

g

005

mVV

g

002

g

01

g

002

g

01

mVV

Quiescent Current

90

75

90

m

A

(Note 9)

131

160

116

139

m

A

92

76

92

m

A

132

163

117

142

m

A

Change of Quiescent

a

05

20

05

20

m

A

Current (Note 3)

a

10

30

10

30

m

A

Temperature Coefficient

a

030

a

05

a

030

a

05

m

A F

of Quiescent Current

Minimum Temperature

In circuit of

Figure 1

a

30

a

50

a

30

a

50

F

for Rated Accuracy

Long-Term Stability

g

016

g

016

F

Note 1

Note 2

Thermal resistance of the TO-46 package is 720 FW junction to ambient and 43 FW junction to case Thermal resistance of the TO-92 package is

324 FW junction to ambient Thermal resistance of the small outline molded package is 400 FW junction to ambient For additional thermal resistance informa-

tion see table in the Typical Applications section

Note 3

Regulation is measured at constant junction temperature using pulse testing with a low duty cycle Changes in output due to heating effects can be

computed by multiplying the internal dissipation by the thermal resistance

Note 4

Tested limits are guaranteed and 100% tested in production

Note 5

Design limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges These limits are not used to

calculate outgoing quality levels

Note 6

Specification in BOLDFACE TYPE apply over the full rated temperature range

Note 7

Accuracy is defined as the error between the output voltage and 10 mV F times the device’s case temperature at specified conditions of voltage current

and temperature (expressed in F)

Note 8

Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the device’s rated temperature

range

Note 9

Quiescent current is defined in the circuit of

Figure 1

Note 10

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur DC and AC electrical specifications do not apply when

operating the device beyond its rated operating conditions (see Note 1)

Note 11

Human body model 100 pF discharged through a 15 kX resistor

Note 12

See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National

Semiconductor Linear Data Book for other methods of soldering surface mount devices

2