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APM2017-P29 bảng dữ liệu(PDF) 1 Page - Advanced Semiconductor Business Inc.

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Giải thích chi tiết về linh kiện  Medium Power Amplifier Module
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nhà sản xuất  ASB [Advanced Semiconductor Business Inc.]
Trang chủ  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

APM2017-P29 bảng dữ liệu(HTML) 1 Page - Advanced Semiconductor Business Inc.

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www.asb.co.kr
September 2017
plerowTM APM2017-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Parameter
Unit
Specifications
Min
Typ
Max
Frequency Range
MHz
2010
2025
Gain
dB
32
33
Gain Flatness
dB
0.3
0.5
Noise Figure
dB
2.0
2.1
Output IP3 (1)
dBm
44
47
S11/S22 (2)
dB
-18/-10
Output P1dB
dBm
28
30
Switching Time (3)
sec
-
1
Supply Current
mA
460
500
Supply Voltage
V
5
Impedance
50
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Note: Operating temperature is
–40
C to +85 C.
1) OIP3 is measured with two tones at an output power of 15 dBm/tone separated by 1 MHz.
2) S11, S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to 5 V
Pin Number
Function
3
RF In
8
RF Out
10
Vs
Others
Ground
Outline Drawing (Unit: mm)
Features
Specifications
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Description
APM2017-P29
ASB Inc.
Solder Stencil Area
Ø
0.3 plated thru holes to ground plane
plerow
·
S21 = 33.3 dB@2010 MHz
= 32.7 dB@2025 MHz
·
NF of 2.0 dB over Frequency
·
Unconditionally Stable
·
Single 5 V Supply
·
High OIP3@Low Current
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
More Information
2-stage Single Type
(Top View)
(Bottom View)
(Side View)
2 x Ø 2.0 plated thru holes to screw on heat sinker
APM2017-P29 is an internally matched amplifier mini-
module for such application band in SMD package
with the output P1dB of 30 dBm. It is compactly de-
signed for low current consumption and high OIP3.
Integrating all the components for biasing and match-
ing within the module enhances production yield and
throughput as well. It passes through the stringent
DC, RF, and reliability tests. Not sample test but 100%
quality control test is made before packing.
Typ.@T = 25
C, Vs = 5 V, Freq. = 2017.5 MHz, Zo.sys = 50 ohms


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