PIC12CE673-04SLASHP datasheet(84/116 Pages) MICROCHIP

84 / 116 page

PIC12CE67X

DS40181B-page 84

Preliminary

12.2

DC Characteristics:

PIC12LCE673-04 (Commercial, Industrial)

PIC12LCE674-04 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise speciﬁed)

Operating temperature

0˚C

≤ TA ≤ +70˚C (commercial)

–40˚C

≤ TA ≤ +85˚C (industrial)

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

Supply Voltage

VDD

2.5

5.5

XT, INTRC, EXTRC and LP osc conﬁguration

(DC - 4 MHz)

D002*

RAM Data Retention

Voltage (Note 1)

VDR

TBD

Device in SLEEP mode

D003

VDD start voltage to

ensure internal

Power-on Reset

signal

VPOR

VSS

See section on Power-on Reset for details

D004*

VDD rise rate to

ensure internal

Power-on Reset

signal

SVDD

TBD

V/ms See section on Power-on Reset for details

D010

D010B

D010A

Supply Current

(Note 2)

IDD

TBD

µA

XT, EXTRC osc conﬁguration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

INTRC osc conﬁguration

FOSC = 4 MHz, VDD = 3.0V (Note 5)

LP osc conﬁguration

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

D020

D021

D021A

Power-down Current

(Note 3)

IPD

TBD

µA

VDD = 3.0V, WDT enabled, –40

°C to +85°C

VDD = 3.0V, WDT disabled, 0

°C to +70°C

VDD = 3.0V, WDT disabled, –40

°C to +85°C

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

For EXTRC osc conﬁguration, current through Rext is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: INTRC calibration value is for 4 MHz nominal at 5V, 25

°C.

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