ST34F THRU ST310F

Reverse Voltage - 40 to 100 Volts

Forward Current - 3.0 Amperes

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.

2.Thermal resistance from junction to ambient at 0.375

”(9.5mm)lead length,P.C.B. mounted

Ratings at 25 C ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

ST34F

ST36F

ST310F

40

28

40

60

42

60

SYMBOLS

UNITS

3.0

80.0

0.50

Operating junction temperature range

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

0.375

”(9.5mm) lead length(see fig.1)

Peak forward surge current

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

Maximum instantaneous forward voltage at 3.0A

Maximum DC reverse current

at rated DC blocking voltage

Typical junction capacitance (NOTE 1)

0.10

R

75

500

pF

C

mA

Typical thermal resistance (NOTE 2)

C/W

100

70

100

Storage temperature range

C

-55 to +150

-55 to +125

-55 to +150

20.0

10.0

0.41

0.60

0.02

V

V

V

A

A

V

0.03

60.0

SURFACE MOUNT TRENCH SCHOTTKY RECTIFIER

FEATURES

MECHANICAL DATA

The plastic package carries Underwriters Laboratory

Flammability Classification 94V-0

Metal silicon junction,majority carrier conduction

High efficiency operation

High forward surge current capability

High temperature soldering guaranteed:

5 lbs. (2.3kg) tension

Ultra low forward voltage drop,low power losses

MDD Catalog Number

Dimensions in inches and (millimeters)

SMAF

Cathode Band

Top View

0.130(3.3)

0.146(3.7)

0.193(4.90)

0.173(4.40)

0.106(2.70)

0.094(2.40)

0.051(1.30)

0.063(1.60)

0.051(1.30)

0.043(1.10)

0.0091(0.23)

0.0071(0.18)

0.051(1.30)

0.039(1.0)

Case

Terminals: Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight:0.0018 ounce, 0.064 grams

: JEDEC SMAF molded plastic body over passivated chip