28

31

35

42

56

70

105

140

V

40

45

50

60

80

100

150

200

V

TO-251/IPAK

e: TO-251/IPAK, Molded Plastic

Mounting Position: Any

Polarity: See Diagram

erminals: Plated Leads Solderable per

0.85

0.92

= 4A

V

Cas

MBR840CP-MBR8200CP

1 of 2

°C/W

pF

0.70

V

880CP

Characteristic

Symbol

Classification Rating 94V-O

Plastic Case Material has UL Flammability

Guard Ring Die Construction

For Use in Low Voltage Application

Low Power Loss, High Efficiency

Ideally Suited for Automatic Assembly

8.0 A SCHOTTKY BARRIER DIODE

Features

Mechanical Data

!

!

T

MIL-STD-202, Method 208

!

!

!

Lead Free: For RoHS / Lead Free Version

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

!

Schottky Barrier Chip

!

!

!

!

!

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMS Reverse Voltage

Average Rectified Output Current

(Note 1)

8. 0

A

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

A

Forward Voltage

FM

Peak Reverse Current

At Rated DC Blocking Voltage

0.1

20

mA

Typical Junction Capacitance (Note 2)

Typical Thermal Resistance (Note 1)

Operating and Storage Temperature Range

-55 to +175

°C

Note: 1. Valid provided that leads are kept at ambient temperature at a distance of 9.5mm from the case.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.

MBR

840CP

MBR

850CP

MBR

860CP

8100CP

Units

0.80

350

280

200

15

Z ibo Seno Electronic Engineering Co., Ltd.

www.senocn.com

8200CP

100

MBR

845CP

MBR840CP-MBR8200CP

MBR

MBR

-55 to +150

MBR

8150CP

MBR

Alldatasheet